{"id":9864,"date":"2018-08-16T07:20:11","date_gmt":"2018-08-15T22:20:11","guid":{"rendered":"https:\/\/user.spring8.or.jp\/resrep\/?p=9864"},"modified":"2020-11-20T16:44:35","modified_gmt":"2020-11-20T07:44:35","slug":"x%e7%b7%9a%e5%9b%9e%e6%8a%98%e6%b3%95%e3%81%ab%e3%82%88%e3%82%8b%e5%8d%8a%e5%b0%8e%e4%bd%93%e3%83%91%e3%83%83%e3%82%b1%e3%83%bc%e3%82%b8%e7%94%a8%e7%86%b1%e7%a1%ac%e5%8c%96%e6%80%a7%e5%b0%81-3","status":"publish","type":"post","link":"https:\/\/user.spring8.or.jp\/resrep\/?p=9864","title":{"rendered":"X\u7dda\u56de\u6298\u6cd5\u306b\u3088\u308b\u534a\u5c0e\u4f53\u30d1\u30c3\u30b1\u30fc\u30b8\u7528\u71b1\u786c\u5316\u6027\u5c01\u6b62\u6a39\u8102\/\u9285\u30ea\u30fc\u30c9\u30d5\u30ec\u30fc\u30e0\u754c\u9762\u306e\u6b8b\u7559\u5fdc\u529b\u89e3\u6790\u304a\u3088\u3073\u71b1\u6642\u5fdc\u529b\u5909\u5316\u305d\u306e\u5834\u89e3\u67903 <br>In Situ Residual Stress Analysis of Semiconductor Packages Comprising Thermosetting Encapsulation Resins and Copper Lead Frame under Thermal Process by X-ray Diffraction. Part 3"},"content":{"rendered":"<i class=\"fa-sharp fa-solid fa-file-pdf\"><\/i> <a class=\"download-link\" title=\"\" href=\"https:\/\/user.spring8.or.jp\/resrep?download=10205&#038;tmstv=1777441516\" rel=\"nofollow\">\n\tDownload PDF<\/a> (591.95 KB)\n\n\n<link rel =\"stylesheet\" href=\"https:\/\/cdnjs.cloudflare.com\/ajax\/libs\/font-awesome\/6.3.0\/css\/all.min.css\">\n\n<style>\n.fa-file-pdf{\ncolor:#cc3300;\n}\n<\/style>","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[28,26],"tags":[],"class_list":["post-9864","post","type-post","status-publish","format-standard","hentry","category-volume6-2","category-volume6-2018"],"_links":{"self":[{"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/posts\/9864","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=9864"}],"version-history":[{"count":4,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/posts\/9864\/revisions"}],"predecessor-version":[{"id":13935,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/posts\/9864\/revisions\/13935"}],"wp:attachment":[{"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=9864"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=9864"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=9864"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}