{"id":8111,"date":"2017-01-31T09:19:23","date_gmt":"2017-01-31T00:19:23","guid":{"rendered":"https:\/\/user.spring8.or.jp\/resrep\/?p=8111"},"modified":"2019-05-24T14:10:16","modified_gmt":"2019-05-24T05:10:16","slug":"%e5%8d%8a%e5%b0%8e%e4%bd%93%e3%83%91%e3%83%83%e3%82%b1%e3%83%bc%e3%82%b8%e5%9f%ba%e6%9d%bf%e3%81%ab%e3%81%8a%e3%81%91%e3%82%8b%e5%9f%ba%e6%9d%bf%e6%a8%b9%e8%84%82%e9%8a%85%e7%ae%94%e7%95%8c%e9%9d%a2-2","status":"publish","type":"post","link":"https:\/\/user.spring8.or.jp\/resrep\/?p=8111","title":{"rendered":"<p>\u534a\u5c0e\u4f53\u30d1\u30c3\u30b1\u30fc\u30b8\u57fa\u677f\u306b\u304a\u3051\u308b\u57fa\u677f\u6a39\u8102\/\u9285\u7b94\u754c\u9762\u306e\u6b8b\u7559\u5fdc\u529b\u9762\u5185\u4e0d\u5747\u4e00\u6027\u89e3\u6790<br \/>Analysis of Spatial Inhomogeneity of Residual Stress at Interface between Substrate Resins and Copper Foils in Semiconductor Packaging Substrates<\/p>"},"content":{"rendered":"<i class=\"fa-sharp fa-solid fa-file-pdf\"><\/i> <a class=\"download-link\" title=\"\" href=\"https:\/\/user.spring8.or.jp\/resrep?download=8193&#038;tmstv=1777531765\" rel=\"nofollow\">\n\tDownload PDF<\/a> (283.42 KB)\n\n\n<link rel =\"stylesheet\" href=\"https:\/\/cdnjs.cloudflare.com\/ajax\/libs\/font-awesome\/6.3.0\/css\/all.min.css\">\n\n<style>\n.fa-file-pdf{\ncolor:#cc3300;\n}\n<\/style>","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[24,23],"tags":[],"class_list":["post-8111","post","type-post","status-publish","format-standard","hentry","category-volume5-1","category-volume5-2017"],"_links":{"self":[{"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/posts\/8111","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=8111"}],"version-history":[{"count":2,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/posts\/8111\/revisions"}],"predecessor-version":[{"id":8195,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/posts\/8111\/revisions\/8195"}],"wp:attachment":[{"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=8111"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=8111"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=8111"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}