{"id":7230,"date":"2016-07-25T09:35:20","date_gmt":"2016-07-25T00:35:20","guid":{"rendered":"https:\/\/user.spring8.or.jp\/resrep\/?p=7230"},"modified":"2016-07-25T09:35:20","modified_gmt":"2016-07-25T00:35:20","slug":"%e5%8d%8a%e5%b0%8e%e4%bd%93%e3%83%91%e3%83%83%e3%82%b1%e3%83%bc%e3%82%b8%e5%9f%ba%e6%9d%bf%e7%94%a8%e6%a8%b9%e8%84%82%e3%81%ae%e7%86%b1%e7%a1%ac%e5%8c%96%e9%81%8e%e7%a8%8b%e3%81%ab%e3%81%8a%e3%81%91-2","status":"publish","type":"post","link":"https:\/\/user.spring8.or.jp\/resrep\/?p=7230","title":{"rendered":"<p>\u534a\u5c0e\u4f53\u30d1\u30c3\u30b1\u30fc\u30b8\u57fa\u677f\u7528\u6a39\u8102\u306e\u71b1\u786c\u5316\u904e\u7a0b\u306b\u304a\u3051\u308b\u6b8b\u7559\u5fdc\u529b\u305d\u306e\u5834\u89b3\u5bdf<br \/>In situ Residual Stress Analysis in Resins for Semiconductor Packaging Substrates during Curing Process<\/p>"},"content":{"rendered":"<i class=\"fa-sharp fa-solid fa-file-pdf\"><\/i> <a class=\"download-link\" title=\"\" href=\"https:\/\/user.spring8.or.jp\/resrep?download=7377&#038;tmstv=1777441606\" rel=\"nofollow\">\n\tDownload PDF<\/a> (288.02 KB)\n\n\n<link rel =\"stylesheet\" href=\"https:\/\/cdnjs.cloudflare.com\/ajax\/libs\/font-awesome\/6.3.0\/css\/all.min.css\">\n\n<style>\n.fa-file-pdf{\ncolor:#cc3300;\n}\n<\/style>","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[22,20],"tags":[],"class_list":["post-7230","post","type-post","status-publish","format-standard","hentry","category-volume4-2","category-volume4-2016"],"_links":{"self":[{"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/posts\/7230","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=7230"}],"version-history":[{"count":3,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/posts\/7230\/revisions"}],"predecessor-version":[{"id":7532,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=\/wp\/v2\/posts\/7230\/revisions\/7532"}],"wp:attachment":[{"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=7230"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=7230"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/user.spring8.or.jp\/resrep\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=7230"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}