Title/Place of Publication
8269
2007.01.30 10:56
10.1115/IPACK2005-73083
Nondestructive Evaluation of Thermal Phase Growth in Solder Ball Micro-Joints by Synchrotron Radiation X-Ray Micro-Tomography
Refereed Journals, Doctoral Thesis, Refereed Proceedings
Proceedings of IPACK2005
IPACK2005 2005 73083
InterPACK2005 (2005 ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems)
2005.07.17-07.22 San Francisco, California, USA
Authors
 
First Author 0014117 Sayama Toshihiko Toyama Industrial Technology Center
Coauthor 1 0014152 Tsuritani Hiroyuki Toyama Industrial Technology Center
Coauthor 2 0001544 Uesugi Kentaro SPring-8/JASRI
Coauthor 3 0004116 Tsuchiyama Akira Osaka University
Coauthor 4 0004129 Nakano Tsukasa National Institute of Advanced Industrial Science and Technology
Coauthor 5 0005439 Yasuda Hideyuki Osaka University
Related Proposal Information
2004A0097 BL47XU 佐山 利彦