Title/Place of Publication
Publication ID
6539
Date Created
2007.01.30 10:56
DOI
10.2472/jsms.53.728
Open Access URL
https://doi.org/10.2472/jsms.53.728
English Title
In-situ Synchrotron Measurement of Thermal Stress in Textured Copper Thin Films during Thermal Cycling
Type of Publication
Refereed Journals, Doctoral Thesis, Refereed Proceedings
Place of Publication (Journal)
Journal Title
材料 (Journal of the Society of Materials Science, Japan)
Vol.
53
No.
7
Year of Publication
2004
Page
728-733
Place of Publication (Oral, Poster)
Conference Title
Date
Venue
Research Area
Research Method
Authors
User Card ID No.
Last/Family
First/Given
Affiliation
Corresponding
Author
First Author
0005201
Tanaka
Keisuke
Nagoya University
Coauthor 1
0006323
Ito
Toshimasa
Denso Corporation
Coauthor 2
0006230
Akiniwa
Yoshiaki
Nagoya University
Coauthor 3
Ohta
Hitoyuki
Hitachi, Ltd.
Related Proposal Information
Proposal Number
2002A0281
Beamline
BL02B1
Project Leader
田中 啓介