User Information

Title/Place of Publication
Publication ID	41224
Date Created	2021.02.10 07:32
DOI	10.1007/s11837-020-04521-w
Open Access URL
English Title	Reliability of Cu Nanoparticles/Bi-Sn Solder Hybrid Bonding Under Cyclic Thermal Stresses
Type of Publication	Refereed Journals, Doctoral Thesis, Refereed Proceedings
Place of Publication (Journal)	Journal Title JOM Vol. 73 No. Year of Publication 2021 Page 600-608
Place of Publication (Oral, Poster)	Conference Title Date Venue
Research Area	[A80] Industrial Applications
Research Method	[M60] X-ray Imaging

Authors
	User Card ID No.	Last/Family	First/Given	Affiliation
First Author	0029103	Usui	Masanori	Toyota Central Research and Development Laboratories, Inc.
Coauthor 1		Satoh	Toshikazu	Toyota Central Research and Development Laboratories, Inc.
Coauthor 2	0041895	Kamiyama	Michiaki	Toyota Central Research and Development Laboratories, Inc.
Coauthor 3	0007350	Kimura	Hidehiko	Toyota Central Research and Development Laboratories, Inc.

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Proposal Number 2018B7012 Beamline BL33XU Project Leader 木村英彦