|
37223 |
|
2018.12.04 16:20 |
|
10.1021/acsami.8b15835 |
|
|
|
Fabrication of a Bilayer Structure of Cu and Polyimide to Realize Circuit Microminiaturization and High Interfacial Adhesion in Flexible Electronic Devices |
|
Refereed Journals, Doctoral Thesis, Refereed Proceedings |
|
ACS Applied Materials & Interfaces
10
51
2018
44589-44602
|
|
|
|
[A80] Industrial Applications |
|
[M50] Photoelectron Spectroscopy
|