User Information

Title/Place of Publication
Publication ID	34354
Date Created	2017.08.21 09:05
DOI	10.1016/j.microrel.2017.07.096
Open Access URL
English Title	Effects of Thermal Aging on Cu Nanoparticle/Bi-Sn Solder Hybrid Bonding
Type of Publication	Refereed Journals, Doctoral Thesis, Refereed Proceedings
Place of Publication (Journal)	Journal Title Microelectronics Reliability Vol. 78 No. Year of Publication 2017 Page 93-99
Place of Publication (Oral, Poster)	Conference Title Date Venue
Research Area	[A80] Industrial Applications
Research Method	[M60] X-ray Imaging

Authors
	User Card ID No.	Last/Family	First/Given	Affiliation
First Author	0029103	Usui	Masanori	Toyota Central Research and Development Laboratories, Inc.
Coauthor 1		Satoh	Toshikazu	Toyota Central Research and Development Laboratories, Inc.
Coauthor 2	0007350	Kimura	Hidehiko	Toyota Central Research and Development Laboratories, Inc.
Coauthor 3		Tajima	Satomi	Toyota Central Research and Development Laboratories, Inc.
Coauthor 4	0007519	Hayashi	Yujiro	Toyota Central Research and Development Laboratories, Inc.
Coauthor 5	0024524	Setoyama	Daigo	Toyota Central Research and Development Laboratories, Inc.
Coauthor 6		Kato	Masashi	Nagoya Institute of Technology

Related Proposal Information
Proposal Number 2016A7012 Beamline BL33XU Project Leader 木村英彦
Proposal Number 2016B7012 Beamline BL33XU Project Leader 木村英彦