Title/Place of Publication
Publication ID
15556
Date Created
2009.12.10 09:22
DOI
10.1299/kikaia.75.799
Open Access URL
https://www.jstage.jst.go.jp/article/kikaia1979/75/755/75_KJ00005652770/_article/-char/ja/
English Title
Nondestructive Evaluation of Thermal Fatigue Lifetime in Flip Chip Solder Joints by Synchrotron Radiation X-Ray Microtomography
Type of Publication
Refereed Journals, Doctoral Thesis, Refereed Proceedings
Place of Publication (Journal)
Journal Title
日本機械学会論文集 A編 (Transactions of the Japan Society of Mechanical Engineers, Series A)
Vol.
75
No.
755
Year of Publication
2009
Page
799-806
Place of Publication (Oral, Poster)
Conference Title
Date
Venue
Research Area
[A10] Life Science
Research Method
Authors
User Card ID No.
Last/Family
First/Given
Affiliation
Corresponding
Author
First Author
0014152
Tsuritani
Hiroyuki
Toyama Industrial Technology Center
Coauthor 1
0014117
Sayama
Toshihiko
Toyama Industrial Technology Center
Coauthor 2
0016517
Okamoto
Yoshiyuki
Cosel Co., Ltd.
Coauthor 3
0014147
Takayanagi
Takeshi
Cosel Co., Ltd.
Coauthor 4
0001544
Uesugi
Kentaro
SPring-8/JASRI
Coauthor 5
0014180
Mori
Takao
Toyama Prefectural University
Related Proposal Information
Proposal Number
2006A0108
Beamline
BL20XU
Project Leader
高柳 毅
Proposal Number
2005B0767
Beamline
BL47XU
Project Leader
高柳 毅